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US Patent Issued to GENERAL SILICONES on Jan. 20 for "Silicone elastomer, and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,273, issued on Jan. 20, was assigned to GENERAL SILICONES Co. LTD. (Hsinchu, Taiwan). "Silicone elastomer, and manufacturing method thereof... Read More


US Patent Issued to IQE on Jan. 20 for "Porous distributed Bragg reflector apparatuses, systems, and methods" (British Inventor)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,393, issued on Jan. 20, was assigned to IQE plc (Cardiff, Great Britain). "Porous distributed Bragg reflector apparatuses, systems, and met... Read More


US Patent Issued to Capital One Services on Jan. 20 for "Using biometric behavior to prevent users from inappropriately entering sensitive information" (Colorado, New York, District Of Columbia Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,439, issued on Jan. 20, was assigned to Capital One Services LLC (McLean, Va.). "Using biometric behavior to prevent users from inappropria... Read More


US Patent Issued to THE JAPAN STEEL WORKS on Jan. 20 for "Drive mechanism, injection apparatus, and injection molding machine" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,238, issued on Jan. 20, was assigned to THE JAPAN STEEL WORKS LTD. (Tokyo). "Drive mechanism, injection apparatus, and injection molding ma... Read More


US Patent Issued to Honda Motor on Jan. 20 for "Outer rotor motor with rotor attachment member" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,451, issued on Jan. 20, was assigned to Honda Motor Co. Ltd. (Tokyo). "Outer rotor motor with rotor attachment member" was invented by Naok... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 20 for "Semiconductor package including SoIC die stacks" (Taiwanese Inventor)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,776, issued on Jan. 20, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package including SoI... Read More


US Patent Issued to LG Electronics on Jan. 20 for "Fabric treating apparatus" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. RE50,755, issued on Jan. 20, was assigned to LG Electronics Inc. (Seoul, South Korea). "Fabric treating apparatus" was invented by Sung Min Kim (S... Read More


US Patent Issued to DATANG MOBILE COMMUNICATIONS EQUIPMENT on Jan. 20 for "Broadcast data communication method and apparatus, and device" (Chinese Inventor)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,274, issued on Jan. 20, was assigned to DATANG MOBILE COMMUNICATIONS EQUIPMENT Co. LTD. (Beijing). "Broadcast data communication method and... Read More


US Patent Issued to LG Electronics on Jan. 20 for "Method and device for determining HARQ feedback option in NR V2X" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,658, issued on Jan. 20, was assigned to LG Electronics Inc. (Seoul, South Korea). "Method and device for determining HARQ feedback option i... Read More


US Patent Issued to GOOGLE on Jan. 20 for "Data layers for a vehicle map service" (California Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,149, issued on Jan. 20, was assigned to GOOGLE LLC (Mountain View, Calif.). "Data layers for a vehicle map service" was invented by Christi... Read More